Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm

Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm

Manufacturer:

Manufacturer Part No:

HF625-0.005-AC-104

Enrgtech Part No:

ET16801552

Warranty:

Manufacturer

$ 0.84

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Dimensions:

25 x 19mm

Thickness:

0.127mm

Length:

25mm

Width:

19mm

Thermal Conductivity:

0.5W/m·K

Material:

Hi-Flow 625

Self-Adhesive:

Yes

Minimum Operating Temperature:

-30°C

Maximum Operating Temperature:

+150°C

Material Trade Name:

Hi-Flow 625

Operating Temperature Range:

-30 → +150 °C

0900766b800205a7.pdf(datasheets)